Dicing tape

FFWafer film frame used for dicing wafer-substrate

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12").

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment,
- Plastic models available for shipping purposes

LMKSMetal Dicing blade hubtype serie K&S

Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.

- Ready to mount on the dicing machine (hubtype models)
- Available in various thicknesses / exposures
- Diamond grit sizes range adapted to all dicing applications

F07Standard dicing tape

Microworld offers a standard tape series for wafer dicing applications.

- Medium adhesion force
- PVC expandable base with acrylic adhesive
- No silicone (contaminants-free)
- Packaged in roll

F20UV dicing tape

Microworld offers a UV sensitive tape series for wafer dicing applications.

- PVC based film with UV sensitive adhesive
- Good and homogeneous expansion after dicing in order to separate the dies for a safe picking
- The UV features allow a high adhesion while dicing and a low adhesion after UV curing for picking
- Backing layer
- Packaged in roll hermetic packing (metallized sleeve)

F08Standard dicing tape medium-high tackiness

Microworld offers a standard tape series for wafer dicing applications.

- Medium-High adhesion force
- PVC expandable base with acrylic adhesive
- No silicone (contaminants-free)
- Packaged in roll

F09Standard dicing tape low tackiness

Microworld offers a standard tape series for wafer dicing applications.

- Low adhesion force
- PVC expandable base with acrylic adhesive
- No silicone (contaminants-free)
- Packaged in roll

F05Standard dicing tape

Microworld offers a standard tape series for wafer dicing applications.

- Medium adhesion force
- PVC expandable base with acrylic adhesive
- No silicone added (Contaminants-free)
- Packaged in roll

F27UV dicing tape

Microworld offers a UV sensitive tape series for wafer dicing applications.

- Poly-Olefine based with acrylic adhesive and PET backing layer
- The UV sensitive adhesive offers a high adhesion force during dicing turning very low after UV cure ideal for dies pick up
- PVC core
- Packaged in roll hermetic packing (metallized sleeve)

LR22" hubless resin dicing blades

Resin diamond blades are specifically designed for high-precision cutting applications in the semiconductor industry. Thanks to their optimized structure, they offer a smooth and controlled cutting action, minimizing mechanical stress on components while ensuring excellent surface finish quality.

Particularly suited to fragile materials and thin wafers, they produce clean cuts with minimal chipping and micro-cracks.

The resin bond ensures constant renewal of the diamond grains during the cutting operation, guaranteeing an excellent balance between performance, surface finish quality, and wear control. This technology is especially recommended when the quality of the cutting edge and component protection are critical requirements.

Advantages:

• Excellent surface quality after cutting
• Significant reduction in chipping and edge defects
• Low mechanical stress on sensitive substrates
• Precise and consistent cutting
• Wide range of diamond grit sizes
• Optimized production throughput
• Compatible with leading diking equipment on the market

Applications:

- Silicon (Si) wafers
- Silicon carbide (SiC)
- Gallium nitride (GaN)
- Technical glass and ultra-thin glass
- Advanced ceramics
- Electronic substrates
- Optoelectronic components
- MEMS, sensors, and power devices
- Technology dedicated to precision

MW-FLFlange for hubless dicing blades

Two assembled male and female parts allow maintaining round hubless diamond dicing blades metal or resin bond.

- Material stainless steel or Titanium
- For blades up to 60 mm diameter
- The flange OD determines the blade exposure
- A dismounting tool (separately supplied) is needed to disassemble the flange

LMFIMetal Dicing blade hubtype

Diamond metal bonded blades for semiconductor thin materials dicing, for Silicon, GaAs, InP...And all associated materials used in production and research of semiconductor devices.

- Ready to mount on the dicing machine (hubtype models)
- Available in various thicknesses / exposures
- Diamond grit sizes range adapted to all dicing applications

F04Standard thick dicing tape

Microworld offers a standard tape series for wafer dicing applications.

- Medium-high adhesion force
- PVC expandable base with acrylic adhesive
- No silicone added (Contaminants-free)
- Packaged in roll

F03Standard dicing tape high tackiness

Microworld offers a standard tape series for wafer dicing applications.

- High adhesion force
- PVC expandable base with rubber adhesive
- No silicone added (Contaminants-free)
- Packaged in roll

LR33" hubless resin dicing blades

Resin diamond blades are specifically designed for high-precision cutting applications in the semiconductor industry. Thanks to their optimized structure, they offer a smooth and controlled cutting action, minimizing mechanical stress on components while ensuring excellent surface finish quality.

Particularly suited to fragile materials and thin wafers, they produce clean cuts with minimal chipping and micro-cracks.

The resin bond ensures constant renewal of the diamond grains during the cutting operation, guaranteeing an excellent balance between performance, surface finish quality, and wear control. This technology is especially recommended when the quality of the cutting edge and component protection are critical requirements.

Advantages:

• Excellent surface quality after cutting
• Significant reduction in chipping and edge defects
• Low mechanical stress on sensitive substrates
• Precise and consistent cutting
• Wide range of diamond grit sizes
• Optimized production throughput
• Compatible with leading diking equipment on the market

Applications:

- Silicon (Si) wafers
- Silicon carbide (SiC)
- Gallium nitride (GaN)
- Technical glass and ultra-thin glass
- Advanced ceramics
- Electronic substrates
- Optoelectronic components
- MEMS, sensors, and power devices
- Technology dedicated to precision

F42BUV antistatic dicing tape

Microworld offers an antistatic UV sensitive tape series for wafer dicing applications.

- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)

F43BUV antistatic dicing tape

Microworld offers an antistatic UV sensitive tape series for wafer dicing applications.

- Poly-Olefin based dicing tape with UV sensitive adhesive packaged in roll with backing layer.
- The tape has an antistatic layer which dissipates the negative charge build-up
- The UV sensitive adhesive provides a high tackiness for dicing and a low value for die pick up
- Packaged in roll hermetic packing (metallized sleeve)