Test and burn in socket

Search results for "Test and burn in socket"

45 products found

SOKQFNStandard test socket for QFN packages

Burn in and Test sockets for for QFN packages, selected from catalog or by analysis of device drawing and specific development.

• Fine Pitches of 0.22 mm and greater, temperaturel
• Over 1300 QFN's designs, ClamShell or Open Top, screw-lid...
• Specific options are available such as non-magnetic, power dissipation (heatsink), Kelvin...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SOKCUSTCustomized Test Socket

Burn in and Test socket specifically developped according to Customer SpecSheet for a particular component and associated test environment.

• Applications : HF, high power, failure analysis on packaged devices, new packages testing...
• Fabrication in two steps : Drawing release (2 weeks) - Approval - Fabrication (typical 6 weeks)
• This socket will totally match your application as being developed for it

SODTest socket for SOD device

SOD Test sockets and Burn-in for all package styles : newest, oldest, standard design, semi-custom, full custom..

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

DFNTest socket for DFN device

Burn in and Test sockets for all DFN package styles.
Newest or oldest, available from existing design, or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

DOTest socket for DO device

Burn in and Test sockets for all DO package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SOKBGAStandard test socket for BGA packages

Burn in and Test sockets for all BGA package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Spacing between pads (pitch) from 0.22 mm
• Designed to accommodate variations in case thickness to a large extent
• More than 1300 Designs ClamShell, Open Top, screw tightening...
• Temperature option, non-magnetic, high frequency...
• Send us your component details (dimensional drawing) to check availability and get an offer

SOKLCCTest socket for other packages (Flat-Pack, LCC, Axial-Radial, TO...)

Burn in and Test sockets for all package styles, newest or oldest, available from existing design or developed in semi-custom ou full custom mode.

• Spacing between pads (pitch) depending on case, temperature, options
• Several socket designs of all styles in ClamShell, Open Top, screw fixing...with type C contacts, balls, pogo pins...
• Double height contact options
• Easy installation and unloading of the component
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SCTest socket for SC device

Burn in : SC Test sockets for all package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

FPTest socket for FP device

Burn in and Test sockets for all FP package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

TOTest socket for TO device

Burn in and Test sockets for all TO package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Pitches start at 0.22mm, temperature
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SOTTest socket for SOT device

Supports de test pour tous boitiers SOT, développements existant ou personnalisés selon boitier et spécifications de test.

• Espacement entre plots (pitch) à partir de 0,22 mm, temperature
• Dessinés pour accommoder les variations d'épaisseur de boitier dans une large mesure
• Plus de 1300 Designs ClamShell, Open Top, serrage par vis...
• Nous envoyer les détails de votre composant (schéma dimensionnel) pour vérifier la disponibilité et obtenir une offre

SSOPTest socket for SSOP device

Burn in and Test sockets for all SSOP package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SOICTest socket for SOIC device

SOIC Test sockets (Burn-in).
All package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Designs ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

DDPAKTest socket for DDPAK device

DDPAK Test sockets package (Burn-in).
All styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SMDTest socket for SMD device

Burn in and Test sockets for all SMD package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

BIBBurn-in boards

Designed and fabricated upon Customer Specsheet, single or double-sided, multi-layers, available for all format types of burn in ovens (humidity, temperature, hast).
• Designed for all components style, various pcb options (FR4, polyimide...)
• Electric additional circuitry included (biasing...) if needed
• Designed for standing standard and/or severe thermal environments (Dry, Humidity, Hast test...)
• Fully customized designs for all applications, power dissipation, high frequency, prototyping...

3Dn-TabletopTable printing and process machine

3Dn-Tabletop and 3Dn-Tabletop Trunnion (5/6 axis option) systems are advanced 3D printing and additive manufacturing solutions designed for high-precision fabrication in a compact and versatile format. These systems combine precision motion control, intelligent software, and a range of materials to enable the creation of complex, functional, and detailed objects.

Both systems are tabletop-sized additive manufacturing systems that offer exceptional precision and accuracy. It utilizes a combination of motion control and scanning technology to achieve micron-level resolution, allowing for the creation of intricate structures with fine details. The system supports a wide range of materials, including metals, polymers, ceramics, and composites, providing flexibility for various applications.

One feature of the 3Dn-Tabletop system is its modular architecture. It can be easily configured and customized to meet specific manufacturing needs. The system offers interchangeable tool heads, enabling the integration of various fabrication processes such as precision microdispensing, 3D printing, milling, and pick-and-place assembly. This versatility makes it suitable for a broad range of applications, including prototyping, microfabrication, electronics manufacturing, and biomedical research.

The 3Dn-Tabletop Trunnion system is an extension of the 3Dn-Tabletop, adding two additional rotational axes to the printer's capabilities. This trunnion system enables multi-axis printing, allowing for the creation of complex geometries and curved surfaces with ease. The rotational axis enhances the freedom of design and enables the fabrication of parts with undercuts, overhangs, and other challenging features.

Both the 3Dn-Tabletop and 3Dn-Tabletop Trunnion systems are equipped with sophisticated software packages (nStudio™ and RhinoCAD™) that provides intuitive control over the printing process. The software offers advanced slicing capabilities, CAD integration, and real-time monitoring, ensuring optimal print quality and efficiency. Additionally, the systems are compatible with various file formats, facilitating seamless integration into existing digital design workflows.

3Dn-300Printing and process machine

3Dn-300 is an advanced 3D printing system that combines precision, versatility, and scalability to deliver high-quality additive manufacturing solutions. With its large build volume and robust capabilities, the 3Dn-300 is designed to meet the demanding needs of industrial manufacturing, rapid prototyping, and research applications.

Equipped with SmartPump™ technology, the 3Dn-300 is capable of handling a diverse range of materials, including metals, ceramics, polymers, composites, and even biomaterials. This versatility allows manufacturers and researchers to explore various fabrication possibilities and select the most suitable material for their specific requirements.

The system's precision motion control system ensures exceptional accuracy and repeatability during the printing process. It employs high-resolution positioning sensors and intelligent feedback mechanisms to maintain precise layer alignment and minimize errors. This level of control enables the production of intricate geometries, fine details, and complex structures with superior surface finish.

To further enhance the capabilities of the 3Dn-300, we offer various optional features. These include sintering capabilities, a heated bed for improved material performance, UV curing for rapid material solidification, laser integration for advanced processing techniques, machine vision and scanning for Z-tracking and conformal printing, and real-time process view for monitoring and optimization.

The 3Dn-300 can be integrated with additional modules and tools, such as milling heads, pick-and-place modules, and inspection systems, further expanding its capabilities and enabling multi-process fabrication. This versatility makes it a highly adaptable solution that can address a wide array of manufacturing requirements.

3Dn-300 is a powerful and versatile 3D printing system designed for industrial-scale additive manufacturing. With its large build volume, material versatility, precision motion control, and advanced features, the 3Dn-300 empowers manufacturers and researchers to produce high-quality, complex, and functional parts with efficiency and reliability.

3Dn-500Printing and process machine

The 3Dn-500 is a high speed and precision motion platform, designed specifically for 3D manufacturing of complete products, not just individual parts. This versatile machine offers a wide range of capabilities, including automatic tool changes, a wide material choice with over 10,000 compatible materials, and post-processing options, making it a powerful solution for various industries and applications.

One of the standout features of the 3Dn-500 is its ability to go beyond simple part production and enable the manufacturing of fully functional electronic products. By utilizing automatic tool changes, this user-configurable direct digital manufacturing system can seamlessly transition from a CAD file to a complete finished electronic product. The process involves a combination of different tool heads, each with unique capabilities.

The system excels at controlling and synchronizing multiple tool heads, in series or parallel configurations. This ensures efficient and precise coordination between the different processes involved in the manufacturing workflow.

To further enhance the capabilities of the 3Dn-500, we offer various optional features. These include sintering capabilities, a heated bed for improved material performance, UV curing for rapid material solidification, laser integration for advanced processing techniques, machine vision and scanning for Z-tracking and conformal printing, and real-time process view for monitoring and optimization.

Additionally, the 3Dn Series, which the 3Dn-500 belongs to, complies with SMEMA (Surface Mount Equipment Manufacturers Association) standards for in-line manufacturing. This makes it compatible with factory in a Line (FiL) concept, enabling seamless integration into a larger manufacturing setup.

The 3Dn-500 is a powerful and versatile 3D manufacturing platform that goes beyond traditional part production. With its automatic tool changes, a wide range of materials, and post-processing options, this system enables the creation of fully functional electronic products. By combining multiple tool heads and precise control mechanisms, the 3Dn-500 offers exceptional precision and efficiency, making it an ideal solution for advanced manufacturing applications.

3Dn-700Printing and process machine

3Dx-700 is an advanced 3D printing and manufacturing system that provides a complete solution for product fabrication. This gantry-based system is designed to offer high precision, versatility, and multi-tool capabilities, making it suitable for a wide range of applications across various industries.

The 3Dx-700 utilizes a 5/6 axis motion platform, providing a precise movement control system. This allows the tool heads to move along multiple axes, enabling complex and intricate fabrication processes. With this motion platform, the system can follow paths that are normal to multi-curved surfaces, facilitating true three-dimensional manufacturing capabilities.

The system incorporates a tool changer mechanism, which seamlessly switches between different tool heads: the SmartPump™, nFD™, nMill™, and nPnP™. This tool changer, along with pneumatic ports and clamps, allows for rapid and efficient transitions between different fabrication processes. Whether it's 3D printing, milling, or pick-and-place assembly, the 3Dx-700 provides a seamless workflow to cater to various manufacturing requirements.

To streamline the entire manufacturing process, the 3Dx-700 is equipped with nStudio™ and RhinoCAD™, an advanced software package. nStudio™ provides a comprehensive set of tools for CAD integration, path planning, and control of the tool heads. The software enables the user to go directly from a CAD file to a complete, fully functioning product, including the integration of electronics. This means that the 3Dx-700 not only produces structural components but also allows for the creation of electrically functional structures, resulting in a fully finished product.

By offering an all-in-one manufacturing solution, the 3Dx-700 revolutionizes the concept of 3D printing by transforming it into true 3D manufacturing. From the initial design to the final product, including complex geometries, functional components, and electronics integration, the 3Dx-700 empowers users to create complete and fully operational products with exceptional precision and efficiency.

PACEMeasurement and control software

PACE is a software that provide solution to combine measurement tools, automatic characterisation sequences, import and export datas.

PACE is composed of 3 windows :
- Measurement window : configuration and control of measurement tools
- Measurement sequence window : configuration and control of the sequence execution
- Mapping window : mapping configuration and control of the probe station (for semi-auto probe station)

Interface can be customised to match customer needs :
- MEMS test on PCB holder
- Import of GDS file for wafer mapping
- Control of vector network analyser (Rohde & Schwarz), SMU (Keithley, Keysight...)

UH114Manual wafer / frame film mounter

The UH114 are manual wafer film (wafer mounter) mounting systems up to 12".
For dicing/sawing applications, uniform lamination of an adhesive plastic film is essential. Our machines feature a set of easily adjustable spring loaded rollers as well as film tension bars along the X and Y axes to ensure bubble-free lamination of the film onto the wafer and frame. Additionally, these models feature a shrink film cutting system with adjustable cutting pressure to accommodate different tape base materials and thicknesses.

Roller pressure is adjusted to meet different process requirements and to accommodate different wafer thicknesses. This moves manually along the substrate once the film is stuck. A digital temperature controller ensures consistent temperatures on the chuck for repeatable mounting.

Adjustable alignment brackets and suction cups fit almost all types of film frames including plastic ones. The chuck height is also adjustable relative to the frame height for different wafer thicknesses.

Technical specificities:

- Available in 6", 8" or 12" version
- Adapter to make 6" on 8" machine or 8" on 12" machine possible
- Protective film winder roller assembly for use with film with support layer
- Easily adjustable spring roller assembly
- Uniform film tension
- Uniform adhesion allows for bubble-free lamination
- Circular cutter (wheel type) to cut the film on the film frame
- Adjustable cutting pressure for different films (thickness/hardness)
- Temperature-controlled digital screen
- Chuck height adjustable from top of unit
- Works with film without support or with support (optional)
- Fits wrapped protective film/layer externally or internally.
- Adjustable alignment pins and suction cups
- Accepts all types of film (specify type and size)
- End cutter for film separation
- Anti static electricity system

UH115Semi-automatic wafer / frame film mounter

The UH115 are a semi-automatic wafer film mounting systems up to 12".
For dicing/sawing applications, uniform lamination of an adhesive plastic film is essential. Our machines feature a set of easily adjustable spring loaded rollers as well as film tension bars along the X and Y axes to ensure bubble-free lamination of the film onto the wafer and frame. Additionally, these models feature a shrink film cutting system with adjustable cutting pressure to accommodate different tape base materials and thicknesses.

Roller pressure is adjusted to meet different process requirements and to accommodate different wafer thicknesses. This moves automatically along the substrate after pressing a push button, ensuring an ultra-repeatable process. A digital temperature controller ensures consistent temperatures on the chuck for repeatable mounting.

Adjustable alignment brackets and suction cups fit almost all types of film frames including plastic ones. The chuck height is also adjustable relative to the frame height for different wafer thicknesses.

Technical specificities:

- Available in 6", 8" or 12" version
- Adapter to make 6" on 8" machine or 8" on 12" machine possible
- Protective film winder roller assembly for use with film with support layer
- Easily adjustable spring roller assembly
- Uniform film tension
- Uniform adhesion allows for bubble-free lamination
- Circular cutter (wheel type) to cut the film on the film frame
- Adjustable cutting pressure for different films (thickness/hardness)
- Temperature-controlled digital screen
- Chuck height adjustable from top of unit
- Works with film without support or with support (optional)
- Fits wrapped protective film/layer externally or internally.
- Adjustable alignment pins and suction cups
- Accepts all types of film (specify type and size)
- End cutter for film separation
- Anti static electricity system

LED60TLED illuminator

Illumination set for stereozoom microscope.

- Annular shape provides a uniform illumination
- Intensity adjustable, on/off switch
- Section selection version

MWPA-10High-Speed passive multipurpose probe

Multipurpose passive high-speed probe, used for driving and receiving signals, frequency response from DC to 11 GHz (500 ohm input impedance mode).

- Adaptable on any micropositioner, specify type
- Coaxial 50 ohm cable included (1 m long), terminated by SMA and miniature connector to the coaxial probes
- Easily replaceable coaxial probe tips of 1.5 inch long, 1 or 2 probe points
- Tailored to different input impedance, 50, 250, 500 or 5k ohm by input resistance added

RTP12001200°C Rapid Thermal Processor

The RTP1200 model is a very easy and powerful RTP system able to reach very high temperatures by using 4 tungsten-halogen lamps.

- Temperature speed adjustment
- System under vacuum
- Gas input possible
- Ideal for contact optimization

HMS3000Manual Hall Effect measurement system

Discover our HMS3000 manual Hall effect system, designed for studying and characterizing the electrical properties of semiconductor materials and thin films. This educational and experimental equipment allows for the precise analysis of charge carrier mobility, carrier concentration, and resistivity of samples.

By measuring the voltages generated by Lorentz forces via its permanent magnet module, the system provides a concrete understanding of electronic transport phenomena and the effects of material doping. Compatible with the Van der Pauw method, it enables reliable measurements on various geometries and thin films.

Robust and easy to use, this manual Hall effect system is ideal for higher education laboratories, research centers, and characterization applications in semiconductor physics and materials science.

It is thus possible to calculate:

• Charge carrier mobility
• Majority carrier density (dopants)
• Doping type (P/N ratio)
• Hall voltage / Hall coefficient
• Surface resistances, resistivity, conductivity

Features:

• Sample size: 5x5 mm to 20x20 mm
• Measurement at two temperatures: ambient and 77 K
• Single or double magnet
• LN2 chamber
• ITO reference sample
• Different SPCB sample holders depending on the application

Applications:

- Si, Ge, SiGe, SiC, GaAs, InGaAs, InP, GaN, ZnO, TCOs
- Optoelectronic component
- Nanomaterials - Sensors, MEMS
- Conductive polymer
- Oxide deposit
- Ceramic & Glass
- Batteries
- Electrodes
- Photovoltaic

QUADPRO2ASemi-automatic 4 point probe measurement under temperature

Semi-automatic 4-point in-line temperature measurement system on samples ranging from 10mm to 300mm in diameter.. Capable of measuring surface resistance ranges from 10μΩ/sq to 10GΩ/sq. Several versions possibles to optimize measurement accuracy according to the ranges measured.

Equipment feature:

• V/I measurement, sheet resistance, resistivity or thickness
• Mean, Standard Deviation, Minimum, Maximum and 3Sigma reports for the dataset
• Temperature Coefficient of Resistance (TCR) measurements
• Automated 2D mapping, 3D mapping and cross-section
• Ultra high precision and repeatability
• Comparative mapping

The TCR option

The Resistance Temperature Coefficient option integrates sample temperature control as well as automated injected current control and resistance calculations. Integrated with a thermal chuck system, the test automatically sweeps temperatures over a wide range without moving the test tips.
Measurements are taken at each target temperature and the results are plotted on a graph. The TCR is expressed in parts per million (PPM). Users define the temperature range, steps, and delay for each test point before taking a measurement. A variety of thermal chucks are available to set the range and resolution from room temperature to 300°C, with 1° resolution.
Data can be printed or exported to a spreadsheet for further analysis.

WL210LE8" high accuracy RF manual probe station with local enclosure

This probe station is derivated of the Checkmate series. It includes an additional local chamber that allow temperature measurement (hot/cold) or very low current application

- fA measurements (low leakage)
- Light-tight environnement
- Electrical shielding
- Configuration : 4 HF port or 8 DC/Kelvin port or HF/DC combination
- 300mm version available
- Compatible with high performances ERS chuck (patented air cooling system, temperature from -60°C to 300°C)

UxTBCoaxial Probe holder with teflon isolation

This probe holder allows to mount a probe tip with an angle of 45°.

It is useful for low noise IV measurements with it teflon insulation.

UxGBCoaxial Probe holder with ceramic isolation

This probe holder allows to mount a probe tip with an angle of 45°.

It is useful for low noise IV measurements with it insulation and for high temperature, up to 600°C.

USStandard Probe holder with screw lock

This probe holder allows to mount a probe tip with an angle of 45°.

It is useful for standard IV measurements.
The tip holding is done by screw for very small footprint.

PTSE-PPalladium probe tip

Palladium straight probe tip, the rigid body can be bent and/or cut to clear space above for very short working distance objectives.

- The standard application is probing on pads and/or internal lines
- The palladium material is particularly suitable for surfaces that are difficult to contact or for low current measurements

MOTICAM1080NDigital camera

This camera is very helpfull for direct vision to put probes easily.

- Compatible with our trinoculars microscopes
- C mount
- Multi-outputs for direct vision on monitor (HDMI) and USB

UPStandard Probe holder with spring lock

This probe holder allows to mount a probe tip with an angle of 45°.

It is useful for standard IV measurements.
The tip holding is done by spring for a quick and safe assembly.

WL170-THzHigh stability Millimetric manual probe station

Station specially designed for ultra high frequency applications, with the use of millimetric heads (extenders).
This system allows you to mount a micropositioner with a large plate that can support extenders from the main manufacturers (R&S, VDI, etc.).

- Up to 1.1 THz
- Raised chuck
- Rotation lock
- Long working distance microscope

PTSE-20BCBeryllium copper probe tip

beryllium copper straight probe tip, the rigid body can be bent and/or cut to clear space above for very short working distance objectives.

- The standard application is probing on pads and/or internal lines
- Tip material provides a good answer to probing at high current or on soft surface

MOTICAM4000High definition digital camera

High-definition digital camera for inspecting and assisting with the placement of tips on wafers.

This camera uses a C-mount to be mounted on most microscopes on the market.
Its high definition gives it the possibility of placing the tips on very small pads.
It has several outputs to allow a wide variety of uses (HDMI 4K, USB...).
An SD card can be connected to take quick pictures.

TA-VIS-7575Active antivibration table

The table allows pneumatic filtering of vibrations, the 4 dampers efficiently filter the mechanical noise from the ground or neighbourhood for an ultra fine probe analysis, inspection or assembly.

- Platens available in several dimensions upon size and weight of the equipment
- Individually adjustable air pressure sensors at each corner

TA-VIS-9090Active antivibration table

HP1000V-PSVacuum mini probe station

Compact probing station for high temperature measurements under vacuum.
This completely hermetic station allows you to go up to 1000°C while putting your sample under vacuum.
Tungsten Rhenium tips, very resistant to high temperature and reliable. These tips can be manipulated manually thanks to micropositioners, which facilitates their precise placement on pads whose size is greater than or equal to 10 µm.

Applications:

- Electrical test: resistor, transistor, capacitor
- Electrodes, diodes
- Photovoltaic
- Nanomaterials
- Sensors, MEMS, OLED, infrared...
- Silicon wafer
- Microchip

Specifications:

• Measurements on unit samples, 50x 50mm
• Manual positioning with 4 micropositioners (Up to 7 micropositioners)
• Temperature range: Ambient to 1000°C
• Vaccum chamber

HCP-400-S-100Square hot plate 100mm

This equipment suitable for research laboratories. A temperature range from -120°C to 400°C which allows a wide range of applications from bio-organisms to microelectronics.

Applications:

- Electrodes
- Nano-fluids
- Advanced Ceramics
- Metallic oxide
- Nanomaterials
- Microorganism
- Conductive polymer
- Batteries

Specifications:

• Temperature controller included
• Temperature range: -120°C to 400°C
• Chuck Square

MOTICAMS12Digital Camera

Camera adaptable on all trinocular microscopes, useful for probe tips placing.

- Capture and measurement software supplied
- High resolution camera

TF portableHandheld Eddy Current tester

The portable TF 1010 system is a compact and portable measuring device for resistivity measurement over large areas. It allows the characterization by rapid contact of large conductive surfaces. The system uses the eddy current method. This method allows for non-destructive measurements. It is possible to measure encapsulated samples and components thanks to these weak currents which penetrate non-conductive layers such as oxides or any other coatings. The TF Portable 1010 is an easy-to-use device controlled via a touch screen. Compact, it allows, depending on its configuration, to precisely extract the surface resistance, the resistivity, the thickness or even the anisotropy of a material.

Advantages:

- Small and portable measurement device
- Manual measurement
- Instant live measurement
- Digital data collection and data transmission via Bluetooth
- Characterization of hidden and encapsulated conductive layers

Application:

- Architectural Glass (LowE)
- Mirror coatings
- Reflective layers
- Packaging foils
- Electrode layers in smart / electrochromic glass and energy storage
- Battery electrodes
- Conductive paper and conductive textiles
- Conductor Polymers

MOTICAM1080XDigital camera

This camera is very helpfull for direct vision to put probes easily.

- Compatible with our trinoculars microscopes
- C mount
- Multi-outputs for direct vision on monitor (HDMI) and USB