Micropositioner for prober

Search results for "Micropositioner for prober"

55 products found

S750Joystick micropositioner

This low cost micropositioner was developped for hybrids probing or general probing on 500 µm and larger pads.

- The joystick positioner S750 will accept standard probe holders model Ux.
- A large scan area is coupled with the adjustable Z movement.
- The base is magnetic and the overall dimensions particularly low.
- The spring probe clamp is isolated from the rest of the body while maintaining electrical conductance through a wire termination.
- A model S750-1 with joystick extension is available for more precision of positioning.

SM40RF & Microwave micropositioner

The SM40 micropositioner is specifically designed for RF probing, it has one inch translation capabilities in all axes and a cross-roller bearings to prevent accidentally moving the tip if bumped.

- Accepts all types of coplanar RF probes.
- Perfectly stable with screw-lock fixation on the platen (optional magnetic base).
- An integral co-planarity adjustment provides for adjusting multicontact planarities (GS, GSG, GSGSG configurations).
- It is available with various head configurations allowing the microwave head to be introduced from the front, rear.

SP150Ultra-stable submicronic micropositioner SP150

High-precision ultra-stable micropositioner with inline controls knobs, the SP150 will allow easy landing on pads as well as internal lines with a submicron accuracy.

- The down Z movement of the tip is totally vertical.
- The knobs with micrometric graduations (100TPI) allow an optimal density on the platen.
- Standard head (down movement by the Z fine knob) or Pivot head for a quicker Z positioning.
- The SP150 today represents the state-of-the-art in term of accuracy of positioning.

S725PMicropositioner S725 with pivot head

This economic micropositioner will allow landing on pads or lines down to 20 µm.
Pivot head (quick Z down before fine adjust, ideal for probe station).

SP100High precision micropositioner SP100

High-precision micropositioner with inline controls knobs, the SP100 will allow easy landing on pads as well as internal lines within micron accuracy.

- The down Z movement of the tip is totally vertical.
- The knobs with micrometric graduations (100TPI) allow an optimal density on the platen.
- Pivot head (Quick down Z for pre-positioning then fine movement) or Standard head with Z knob.

SM90RF & Microwave micropositioner

The SM90 micropositioner is specifically designed for RF probing, it has one inch translation capabilities in all axes and a cross-roller bearings to prevent accidentally moving the tip if bumped.

- Accepts all types of coplanar RF probes.
- Perfectly stable with screw-lock fixation on the platen (optional magnetic base).
- An integral co-planarity adjustment provides for adjusting multicontact planarities (GS, GSG, GSGSG configurations).
- It is available with various head configurations allowing the microwave head to be introduced from the front, rear.

S725SMicropositioner S725 with spring head

This micropositioner will allow landing on pads or lines down to 20µm.
Spring head (for fragile surface or temperature), allows limiting the pressure of needles on the pads.

S926PPrecision micropositioner S926 with pivot head

This precision positioner allows placing probe tip on pads or lines within accuracy of the micrometer.
The pivot head is perfect for a quick positioning in Z and fine adjust.

S926SPrecision micropositioner S926 with spring head

This precision micropositioner allows placing probe tips on pads or lines within accuracy of the micrometer.
The spring head is perfect for temperature applications or fragile layers.

S725HTMicropositioner S725 for high temperature

This economic micropositioner will allow probe tips to land on pads or lines down to 20 µm.
Special model for temperature probe test measurement, up to 600°C.

SLAP90-ERF micropositioner for extender

This micropositioner, which is specific to ultra-high frequency RF measurements with a milimetric head, accommodates frequency multipliers.

- East, West configuration
- Screwed base for a better stability
- Angular adjustment to ensure the contact of milimetric heads (GS, GSG configurations)
- Compatible with differents frequency extender models (Rohde & Schwarz, Keysight, VDI ...)

CM170High stability manual probe station

From two model combination, the CM170 probe stations allows stability and accuraccy for moderate price.

- Large platen for frequency extender head use
- Multiple applications (optical, probecards, HF...)

MOST POPULAR REFERENCES

CM170 : DC to 100 MHz measurements
WL170 : DC to 110 GHz measurements
WL170-THz : mmW up to 1.1 THz (special raised chuck)

D3Dark box with platen

This small probe station has been designed for high themperature application, it includes a chuck (ambient or hot chuck) and a circular platen that allow several magnetic micropositioner.

- A microscope can be used to contact small pads
- An economical solution for a variety of probing applications

WL210LE8" high accuracy RF manual probe station with local enclosure

This probe station is derivated of the Checkmate series. It includes an additional local chamber that allow temperature measurement (hot/cold) or very low current application

- fA measurements (low leakage)
- Light-tight environnement
- Electrical shielding
- Configuration : 4 HF port or 8 DC/Kelvin port or HF/DC combination
- 300mm version available
- Compatible with high performances ERS chuck (patented air cooling system, temperature from -60°C to 300°C)

CM4656" semi-automatic probe station

Semi-automatic probing stations for full wafer electrical characterization.

- Software : mapping, auto-alignment, pattern recognition, autofocus...
- X-Y stage drives by induction motor for high speed and accuracy
- Probecard application available
- High voltage (HV -10kV) and low leakage (fA) measurements
- Tool developed for design validation (R&D) and yield monitoring (production)

WL250-LE8" HF semi-automatic probe station with local enclosure

Semi-automatic probing stations for full wafer HF electrical characterization.

- Software : mapping, auto-alignment, pattern recognition, autofocus...
- Probecard application available
- Thermal characterization from -60°C to 300°C
- HF measurements up to 110 GHz
- Tool developed for design validation (R&D) and yield monitoring (production)
- Configuration : up 4 ports HF (N, S, E, W) and 4 DC
- Optional local enclosure for EMI shielding and light-tight

MOST POPULAR REFERENCES

WL250 : 200 mm version
WL350 : 300 mm version
WL250-LE : 200 mm with local enclosure
WL350-LE : 300 mm with local enclosure

USStandard Probe holder with screw lock

This probe holder allows to mount a probe tip with an angle of 45°.

It is useful for standard IV measurements.
The tip holding is done by screw for very small footprint.

UPStandard Probe holder with spring lock

This probe holder allows to mount a probe tip with an angle of 45°.

It is useful for standard IV measurements.
The tip holding is done by spring for a quick and safe assembly.

WL170-THzHigh stability Millimetric manual probe station

Station specially designed for ultra high frequency applications, with the use of millimetric heads (extenders).
This system allows you to mount a micropositioner with a large plate that can support extenders from the main manufacturers (R&S, VDI, etc.).

- Up to 1.1 THz
- Raised chuck
- Rotation lock
- Long working distance microscope

WL350-LE12" HF semi-automatic probe station with local enclosure

H1504" manual probe station

Easy use probe station for wafers up to 100 mm.

- XY chuck movement
- Quick platen lift
- Up to 6 micropositioners or a probecard
- Fixed microscope holder

S1160B-8N8" manual analytical probe station

Probe station under tips for precision analyses, such as IV, CV, on chips alone, on wafers, on components, etc. Modular, the S1160 can accommodate several options and accessories for a multitude of applications (temperature, low current measurements, etc.).

- Rapid elevation of the plate by manual arm (contact / non-contact)
- Accepts binocular and trinocular microscopes
- Wafers up to 8'' (200mm wafers)
- Angular adjustment of the Wafer
- Accommodates up to 8 DC micropositioners or a pin board
- Massive chassis for better stability

COMMON REFERENCES:

S1160A-8N: Optical bridge movement for turret microscope
S1160B-8N: Movement of the optical bridge for trinocular stereozoom microscope
S1160C-8N: Fixed optical bridge for trinocular stereozoom microscope

WL2508" HF semi-automatic probe station

WL1160B-8N8" RF manual analytical probe station

Economical while professional prober for RF and Microwave probing applications, available for single die, partial or full wafer up to 8".

- DC to 110 GHz measurement
- Stable platen and specific anti-resonant chuck construction
- Individual chuck for RF probes with independant rotation
- Quick lift platen and fine Z adjustment
- Allows binocular or trinocular microscope (Tilt-back clearing option)
- Accept up to 4 RF micropositioners and 4 DC micropositioners simultaneously

MOST POPULAR REFERENCES

WL1160A : Moving of optical bridge for turret microscope
WL1160B : Moving of optical bridge for trinocular stereozoom microscope
WL1160C : Fixed optical bridge for trinocular stereozoom microscope

SPCBSample holder for HMS series

These easy probe holders are composed of a small pcb on which the sample under test is held using spring clips.
The sample to measure is square with a pretty small size.

- Four individually adjustable gold plated spring needles allow a good electrical contact on each corner (may need a point of Indium solder deposited for better contact, not always necessary, depends on sample material).
- No soldering necessary

HMS5300Semi-automatic Hall Effect measurement system for high temperatures

Discover our HMS5300 semi-automatic Hall effect system, designed for studying and characterizing the electrical properties of semiconductor materials and thin films at varying temperatures. This educational and experimental equipment allows for the precise analysis of charge carrier mobility, carrier concentration, and sample resistivity.

By measuring the voltages generated under the influence of Lorentz forces via its permanent magnet module, the system provides a concrete understanding of electronic transport phenomena and the effects of material doping. Compatible with the Van der Pauw method, it enables reliable measurements on various geometries and thin films.

Robust and easy to use, this manual Hall effect system is ideal for higher education laboratories, research centers, and characterization applications in semiconductor physics and materials science.

Its semi-automatic temperature ramp system and magnetic field measurements make it completely autonomous during the measurement process.

It is therefore possible to calculate:

• Charge carrier mobility
• Majority carrier density (dopants)
• Doping type (P/N ratio)
• Hall voltage / Hall coefficient
• Surface resistance, resistivity, conductivity

Features:

• Sample size: 5x5mm - 20x20mm
• Motorized dual magnets: 0.5T
• Measurement under temperature: 77K to 350K
• Current range: 1nA - 20mA

Compatibles temperature modules:

- AMP55T-RTSK: Ambient or 77K
- AMP55T-SH80350K: From 77K to 350K
- AHT55T3: From 300K to 570K
- AHT55T5: From 300K to 770K

Applications:

- Si, Ge, SiGe, SiC, GaAs, InGaAs, InP, GaN, ZnO, TCOs
- Optoelectronic component - Nanomaterials
- Sensors, MEMS - Conductive polymer
- Oxide deposit
- Ceramic & Glass
- Batteries
- Electrodes
- Photovoltaic

HMS5500Semi-automatic Hall Effect measurement system for very high temperatures

Discover our HMS5500 semi-automatic Hall effect system, designed for studying and characterizing the electrical properties of semiconductor materials and thin films at varying temperatures. This educational and experimental equipment allows for the precise analysis of charge carrier mobility, carrier concentration, and sample resistivity.

By measuring the voltages generated under the influence of Lorentz forces via its permanent magnet module, the system provides a concrete understanding of electronic transport phenomena and the effects of material doping. Compatible with the Van der Pauw method, it enables reliable measurements on various geometries and thin films.

Robust and easy to use, this manual Hall effect system is ideal for higher education laboratories, research centers, and characterization applications in semiconductor physics and materials science.

Its semi-automatic temperature ramp system and magnetic field measurements make it completely autonomous during the measurement process.

It is therefore possible to calculate:

• Charge carrier mobility
• Majority carrier density (dopants)
• Doping type (P/N ratio)
• Hall voltage / Hall coefficient
• Surface resistance, resistivity, conductivity

Features:

• Sample size: 5x5mm - 20x20mm
• Motorized dual magnets: 0.5T
• Measurement under temperature: 77K to 350K
• Current range: 1nA - 20mA

Compatibles temperature modules:

- AMP55T-RTSK: Ambient or 77K
- AMP55T-SH80350K: From 77K to 350K
- AHT55T3: From 300K to 570K
- AHT55T5: From 300K to 770K

Applications:

- Si, Ge, SiGe, SiC, GaAs, InGaAs, InP, GaN, ZnO, TCOs
- Optoelectronic component - Nanomaterials
- Sensors, MEMS - Conductive polymer
- Oxide deposit
- Ceramic & Glass
- Batteries
- Electrodes
- Photovoltaic

SOKQFNStandard test socket for QFN packages

Burn in and Test sockets for for QFN packages, selected from catalog or by analysis of device drawing and specific development.

• Fine Pitches of 0.22 mm and greater, temperaturel
• Over 1300 QFN's designs, ClamShell or Open Top, screw-lid...
• Specific options are available such as non-magnetic, power dissipation (heatsink), Kelvin...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

FFWafer film frame used for dicing wafer-substrate

Wafer film frame used for maintaining the plastic tape during or after dicing operations, for wafer up to 300 mm (12").

- Standard material Stainless steel (alu optional)
- Sizes and shapes adapted to the dicing equipment,
- Plastic models available for shipping purposes

MW-FLFlange for hubless dicing blades

Two assembled male and female parts allow maintaining round hubless diamond dicing blades metal or resin bond.

- Material stainless steel or Titanium
- For blades up to 60 mm diameter
- The flange OD determines the blade exposure
- A dismounting tool (separately supplied) is needed to disassemble the flange

SODTest socket for SOD device

SOD Test sockets and Burn-in for all package styles : newest, oldest, standard design, semi-custom, full custom..

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

PT110110 GHz flexible cable for RF probe

UTiFLEX® microwave cable assemblies are constructed using a low or ultra-low-density PTFE dielectric coupled with fully shielded outer conductors and a unique connector attachment that withstands mechanical and thermal stresses far better than standard connectors.
The result: Excellent loss characteristics, outstanding phase stability, and superb flexibility compared to standard flexible cables — all without sacrificing mechanical integrity.

Manufactured in Pottstown, PA, location, under the expert guidance of our professional engineering team, every UTiFLEX cable assembly is tested for insertion loss and SWR, and shipped with an individual test certificate.

UFP088D67 GHz flexible cable for RF probe

MW-CSCalibration substrate for RF probe

Calibration substrate series for RF probes, that allow high accuracy measurements.

- GSG, GS, SG or dual (GSSG, GSGSG...) configurations
- Through, short, load (50ohms)...
- Gold plated pads
- Calibration kit for analyzer (R&S, HP...)

DFNTest socket for DFN device

Burn in and Test sockets for all DFN package styles.
Newest or oldest, available from existing design, or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

FixtureBoxDark box for high power application

Compact fixture box solution for High-voltage (HV) and High-current (HC) measurements

- Up to 10kV
- Keithley and Keysight compatibility
- Safety interlock

DOTest socket for DO device

Burn in and Test sockets for all DO package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SOKBGAStandard test socket for BGA packages

Burn in and Test sockets for all BGA package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Spacing between pads (pitch) from 0.22 mm
• Designed to accommodate variations in case thickness to a large extent
• More than 1300 Designs ClamShell, Open Top, screw tightening...
• Temperature option, non-magnetic, high frequency...
• Send us your component details (dimensional drawing) to check availability and get an offer

SOKLCCTest socket for other packages (Flat-Pack, LCC, Axial-Radial, TO...)

Burn in and Test sockets for all package styles, newest or oldest, available from existing design or developed in semi-custom ou full custom mode.

• Spacing between pads (pitch) depending on case, temperature, options
• Several socket designs of all styles in ClamShell, Open Top, screw fixing...with type C contacts, balls, pogo pins...
• Double height contact options
• Easy installation and unloading of the component
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SCTest socket for SC device

Burn in : SC Test sockets for all package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SS-APIndividual box for AP plastic grip-ring

Shipment box for wafer mounted on ring (grip ring).

FPTest socket for FP device

Burn in and Test sockets for all FP package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

TOTest socket for TO device

Burn in and Test sockets for all TO package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Pitches start at 0.22mm, temperature
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SOTTest socket for SOT device

Supports de test pour tous boitiers SOT, développements existant ou personnalisés selon boitier et spécifications de test.

• Espacement entre plots (pitch) à partir de 0,22 mm, temperature
• Dessinés pour accommoder les variations d'épaisseur de boitier dans une large mesure
• Plus de 1300 Designs ClamShell, Open Top, serrage par vis...
• Nous envoyer les détails de votre composant (schéma dimensionnel) pour vérifier la disponibilité et obtenir une offre

SSOPTest socket for SSOP device

Burn in and Test sockets for all SSOP package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

FFSIndividual box for film frame

Shipment box for wafer mounted on frame.

SOICTest socket for SOIC device

SOIC Test sockets (Burn-in).
All package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Designs ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

DDPAKTest socket for DDPAK device

DDPAK Test sockets package (Burn-in).
All styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

SMDTest socket for SMD device

Burn in and Test sockets for all SMD package styles, newest or oldest, available from existing design or developed in semi-custom or full custom mode.

• Pitches start at 0.22mm, temperature
• Low-Profile and small footprint design
• Designed to efficiently accomodate variations in packages thickness
• Over 1300 designs, ClamShell, Open Top, Screw-Lid...
• Please send us the details of your component (mechanical drawing) to check availability and receive an offer

Pen-VacPen for sample handling

This pen makes it easy to handle samples.
By pressing a button, a vacuum is created, which allows the sample to be held.
This product can be taken anywhere where handling is required.

JA40040 GHz flexible cable for RF probe

Juncoax RF coaxial cable is full range from DC to 145GHz, covering flexible / semi-flexible / semi-rigid, super phase-stable, low loss, super light weight, cryogenic, and other cables for harsh environment, 50ohm /70ohm /100ohm and other custom resistance.

Its processing is mainly wrapping and weaving which is manufactured in dust-free stable-temp & stable humidity workshop.

HCP621G-MPGastight mini probe station

Mini test station for temperature and controlled atmosphere measurements.
This completely hermetic ultra-compact station offers you a wide range of possibilities. Rhenium tungsten tips manually manipulated and can be placed on studs >= 100µm.

Applications:

- Electrical test: resistor, transistor, capacitor
- Electrodes, diodes
- Photovoltaic
- Nanomaterials
- Sensors, MEMS, OLED, infrared...
- Silicon wafer
- Microchip

Specifications:

• Measurements on unit samples
• Manual positioning 4 mobile spring-mounted prongs.
• Temperature range: -190°C to 600°C
• Injection of neutral gas (Argon, Nitrogen)

Comparison with -PM version:

For more sensitive application, the -MP has sliding probes which do not move during thermal expansion of the sample and thus do not scratch the sample electrodes whereas the -PM can scratch the pads. The -MP can also be upgraded to an -MPS later.

HCP-600-G-PMGastight mini probe station

HCP421V-PMHNo-magnetic vacuum mini probe station

Mini test station for temperature measurements, under vacuum and non-magnetic.
This completely hermetic ultra-compact station offers you a wide range of possibilities. Rhenium tungsten tips manually manipulated and can be placed on studs >= 100µm. This non-magnetic station will allow you to perform measurements with Helmholtz coils.

Applications:

- Electrical test: resistor, transistor, capacitor
- Electrodes, diodes
- Photovoltaic
- Nanomaterials
- Sensors, MEMS, OLED, infrared...
- Silicon wafer
- Microchip
-Test under magnetic fields

Specifications:

• Station for performing vacuum measurements inside a Helmholtz coil system
• Dimensions of the station 180 mm x 130 mm x 26.5 mm
• Measurements on unit samples, size 38x42 mm
• Manual positioning 4 mobile spring-mounted prongs
• Temperature range: -190°C to 400°C
• Vacuum-tight chamber

HCP-400-V-PMVacuum mini probe station

Mini test station for temperature and vacuum measurements.
This completely hermetic ultra-compact station offers you a wide range of possibilities. Rhenium tungsten tips manually manipulated and can be placed on studs >= 100µm.

Applications:

- Electrical test: resistor, transistor, capacitor
- Electrodes, diodes
- Photovoltaic
- Nanomaterials
- Sensors, MEMS, OLED, infrared...
- Silicon wafer
- Microchip

Specifications:

• Measurements on unit samples, size 28x30 mm
• Manual positioning 4 mobile spring-mounted prongs.
• Temperature range: -190°C to 400°C
• Vacuum capability up to 1 mTorr